CAPABILITIES
Capabilities
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Quick-Turn Protos & Production
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Prototype as quick as 12 hours
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Shortest Standard lead times
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High Volume Production / Supply Chain Management
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2 To 40 Layer Multilayers
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20:1 Drill Aspect Ratio
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Maximum Panel Size - 24" x 30"
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BBV's & Micro Vias
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Via in Pad with Fill Options
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Conductive​
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Non Conductive
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Copper Plug
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Surface Finish Options
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ENIG - Electroless Nickel Immersion Gold
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HASL - Hot Air Solder Leveling
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OSP - Organic Solderability Preservative
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Hard & Soft Gold
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Immersion Silver
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Selective Finishes
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ENEPIG
Base Materials
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ROHS Compliant Options
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High Speed Digital Options
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High Frequency RF Options
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High Temperature Options
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Isola Laminates
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Megtron 6/6G/7/7G
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Ventec Laminates
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Copper Core
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Aluminum Core
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Rogers 3000, 4000, 5000,6000 series
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Taconic & Arlon
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Polyimide & GETEK
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EMC
Product
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Rigid
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Flex
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Rigid-Flex
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Hybrid RF / Digital
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Prototype Quick Turn
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Production Quick Turn
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Metal Core
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Aluminum Backed
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HDI
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Blind/Buried Via
Customer Service
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Concurrent Engineering Solutions
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Quick Quote Response
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DFM Review & Analysis
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Value-Added Engineering Solutions
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Responsive Services Solutions
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Regional Field & FAE Support
Specs and Tolerances
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Outerlayer Trace/Space - .001" / .001"
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Innerlayer Trace/Space = .001"/.001"
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Minimum Drilled Hole - .003"
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Standard Drilled Hole - .010"
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Drill Aspect Ratio - 20 To 1
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Minimum Pad Size - .006"
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Minimum Feature to Edge - .010"
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Minimum Core Thickness - .002"
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Controlled Impedance Tolerance - 5%
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Controlled Depth Drilling - YES
Sequential Lamination - YES